AChiOAlumna
Brilliant_Rock
- Joined
- Mar 10, 2005
- Messages
- 1,678
My w-set is 18K WG and I know that rhodium replating is going to be an ongoing part of my life with my ring, but I would like to lengthen the amount of time between replates. I was told by my jeweler to expect the gold between the 2 rings to yellow first on the underside and between the rings as they rub together. He said one way to minimize this is to solder the rings together...while I usually wear my rings together (99% of the time), there are times where I just want to wear my w-band without the e-ring.
I was considering the use of the plastic ring guards to "attach" the 2 rings together. I thought that this way, my own skin isn''t constantly reacting with the WG (shielded by the plastic) and the two rings won''t be rubbing so much together.
Is this a feasible option?? Am I missing any drawbacks to trying this method? Does anyone have additional methods that I''m missing??
TIA all!!!
I was considering the use of the plastic ring guards to "attach" the 2 rings together. I thought that this way, my own skin isn''t constantly reacting with the WG (shielded by the plastic) and the two rings won''t be rubbing so much together.
Is this a feasible option?? Am I missing any drawbacks to trying this method? Does anyone have additional methods that I''m missing??
TIA all!!!